Sheet-framed ic carrier and method for producing the same

ABSTRACT

A frame sheet comprises a core sheet, and oversheets. A recess is formed in the sheet frame. The oversheet is left in the recess in the sheet frame, and an IC carrier is mounted in the recess. The IC carrier is held, adhered to the oversheet left in the recess.

TECHNICAL FIELD OF THE INVENTION

[0001] The present invention relates to a small-sized IC carrier with anIC module mounted on, and a method for producing a sheet-framed ICcarrier including a sheet frame.

BACKGROUND ART

[0002]FIG. 11(A) is a view which explains a conventional IC carrier anda method for using the same.

[0003] As shown in FIG. 11(A), an IC carrier 41 has an IC module 42mounted on, which includes a CPU, memories, electrodes, etc. integrated.The IC carrier 41 is used as, for example, SIMs (Subscriber IdentityModule) of portable telephones, etc.

[0004] A user acquires an SIM, which corresponds to a telephonesubscription, and can buy a portable telephone 50 of commonspecifications in accordance with his use, and he uses the portabletelephone 50 with the SIM (the IC carrier 41) mounted thereon.

[0005] However, the IC carrier 41 1s not sufficiently prevalent and islimited in uses, and construction of special plants for mass-productionof the IC carrier 41 will lead to cost increase. In a case that the ICcarrier 41 is used as an SIM, the IC carrier 41 is mailed in anenvelope, and its enveloping operation is bothering. A subscriber whohas received the SIM might erroneously handle and break the SIM beforemounting the SIM on the portable telephone 50 or might lose.

[0006] In consideration of the above, it is proposed that the IC card 40is formed by the conventional equipments, and as shown in FIG. 11(B), aslit 44 for facilitating the removal of the IC card 40 is formed in asheet frame 43 with bridges 45 left at a plurality of positions toenable the IC carrier 41 alone to be removed for use. This proposalallows not only the conventional equipments for producing and inspectingthe IC card but also the conventional issue and mail systems of the ICcard to be used as they are.

[0007] However, in the IC carrier of such conventional structure, whenthe IC carrier is removed form the IC base, disadvantageously loads,such as flex, torsion, etc. are applied to the IC module 42, withpossible risks of breakage, leap-out, etc. Disadvantageously the bridgesremain as residual projections when the IC carrier is removed from thesheet frame 43, which makes it difficult for the IC carrier is placed ina mount of the portable telephone 50 and which reversely may damage theIC carrier.

[0008]FIG. 12(A) is a view which explains another example of theconventional IC carrier.

[0009] An application (Japanese Patent Laid-Open Publication No.276870/1995) filed by the applicant of the present application beforethe filing of the present application proposed an IC card 40 comprising,as shown in FIG. 12(B), an adhesive layer 46 a provided on one surfaceof a sheet frame 43 having a recess, and a backing film 46 adhered tothe backside of the sheet frame 43 through the adhesive layer 46 a. AnIC carrier 41 is held fixed in the recess by the adhesive layer 46 aapplied to the backing film 46.

[0010] This example also need the step specialized in providing thebacking film 46 to the backside of the sheet frame 43, whichdisadvantageously adds to costs. Disadvantageously it is difficult toadhere the baking film 46 flat with no air layer between the sheet frame43 and the same.

SUMMARY OF THE INVENTION

[0011] In view of the above-described disadvantages the presentinvention was made, and an object of the present invention is to providea sheet-framed IC carrier which permits an IC carrier to be properlyheld in a sheet frame without the use of the bridges and backing film,and a method for producing the sheet-framed IC carrier.

[0012] The present invention relates to a sheet-framed IC carriercomprising a sheet frame including a core sheet and an oversheetprovided on at least one surface of the core sheet, and including arecess formed therein with the oversheet left; and an IC carrier mountedin the recess of the sheet frame, held by the oversheet left in therecess and including an IC module. The present invention also relates toa method for producing a sheet-framed IC carrier including a sheet framewhich has a core sheet and an oversheet provided on at least one surfaceof the core sheet and has a recess formed therein with the oversheetleft; and an IC carrier which is mounted in the recess of the sheetframe and held by the oversheet left in the recess, and has an ICmodule, the method comprising the step of laying the oversheet on atleast one surface of the core sheet and press-fusing the core sheet andthe oversheet to each other; the step of spot-facing the core sheet toform a recess; the step of forming in the core sheet a peripheral slitto be a peripheral edge of the IC carrier; and the step of mounting theIC module in the recess.

[0013] In the sheet-framed IC carrier according to the present inventionas the IC carrier is held, releasably adhered to the oversheet on thesheet frame, with the recess formed, the IC carrier can be easilyreleased from the sheet frame when required.

[0014] Furthermore, contrary to the conventional IC carrier which isheld by the sheet frame through bridges, the IC carrier of the presentinvention is free from residues and breakages of the edge caused bybreakage of the bridges. It is not necessary to use a special materialand use a separate step, contrary to the conventional case that the ICcarrier is held by an adhesive film.

[0015] In the method for producing the sheet-framed IC carrier accordingto the present invention, such sheet-framed IC carrier can be producedeasily and at low costs by using the conventional equipments.

BRIEF DESCRIPTION OF THE DRAWINGS

[0016]FIG. 1(A) is a plan view of the sheet-framed IC carrier accordingto a first embodiment of the present invention.

[0017]FIG. 1(B) is an A-A sectional view of FIG. 1A.

[0018]FIG. 1(C) is a backside view of the sheet-framed IC carrieraccording to the first embodiment of the present invention.

[0019]FIG. 2(A) is a plan view of the sheet-framed IC carrier accordingto a second embodiment of the present invention.

[0020]FIG. 2(B) is an A-A sectional view FIG. 2A.

[0021]FIG. 2(C) is a backside view of the sheet-framed IC carrieraccording to the second embodiment of the present invention.

[0022]FIG. 3 is a sectional view of the sheet-framed IC carrieraccording to a third embodiment of the present invention.

[0023]FIG. 4 is a sectional view of the sheet-framed IC carrieraccording to a fourth embodiment of the present invention.

[0024]FIG. 5(A) is a plan view of the IC carrier.

[0025]FIG. 5(B) is a backside view of the IC carrier.

[0026]FIG. 6 is a plan view detailing the IC carrier.

[0027]FIG. 7 is a view of the steps of producing the sheet-framed ICcarrier according to the present invention.

[0028]FIG. 8(A) is a view explaining the fusion preventing layerprovided on the IC carrier.

[0029]FIG. 8(B) is a view explaining the fusion preventing layerprovided on the IC carrier.

[0030]FIG. 8(C) is a view explaining the fusion preventing layerprovided on the IC carrier.

[0031]FIG. 9(A) is a view of a state of the IC carrier held on the upperoversheet being peeled off.

[0032]FIG. 9(B) is a view of a state of the IC carrier held on the upperoversheet being peeled off.

[0033]FIG. 10(A) is a view of a state of the IC carrier held on thelower oversheet being peeled off.

[0034]FIG. 10(B) is a view of a state of the IC carrier held on thelower oversheet being peeled off.

[0035]FIG. 11(A) is a view of the conventional IC carrier and a viewexplaining a use thereof.

[0036]FIG. 11(B) is a view of the conventional IC carrier and a view ofa use thereof.

[0037]FIG. 12(A) is a plan view of another example of the conventionalIC carrier.

[0038]FIG. 12(B) is a B-B sectional view of FIG. 12(A).

PREFERRED EMBODIMENTS

[0039] A First Embodiment of the Sheet-Framed IC Carrier

[0040] FIGS. 1(A) to 1(C), FIGS. 5(A) to 5(B), and FIG. 6 are views ofthe sheet-framed IC carrier according to a first embodiment of thepresent invention. FIG. 1(A) is a plan view of the sheet-framed ICcarrier according to the first embodiment. FIG. 1(B) is a sectional viewof the sheet-framed IC carrier according to the first embodiment alongA-A in FIG. 1(A). FIG. 1(C)is a backside view of the sheet-framed ICcarrier according to the first embodiment of the present invention.

[0041] As shown in FIGS. 1(A) to 1(C), the sheet-framed IC carrier 10comprises a sheet frame 13 with a recess 30(FIG. 9(B) formed in whichhas a core sheet 21 and oversheets 22. 23 provided on both surfaces ofthe core sheet 21, and an IC carrier 11 mounted in the recess 30 of thesheet frame 13 and having an IC module 12 mounted on. One of theoversheets, e.g., the oversheet 22 is left in the recess 30 of the sheetframe 13, and the IC carrier in the recess is secured, and adhered tothe oversheet 22.

[0042] The core sheet 21 of the sheet frame 13 and the oversheet 22 areformed of a resin sheet, as of vinyl chloride resin or others, and theIC carrier 11 is held by the oversheet 22 on the side of the module 12.A peripheral edge slit 13 a is formed in the core sheet 21 and theoversheet 23 along the outer periphery of the IC module 12. Theperipheral edge slit 13 a is shown by the dot line in FIG. 1(A) and bythe solid line in FIG. 1(C). A display 18 a is provided on the sheetframe 13, and a display 18 b is provided on the IC carrier 11. A signpanel 19 is provided on the sheet frame 13. A fusion preventing layer 14for preventing fusion with the oversheet 22 is provided on the surfaceof the IC carrier 11 on the side of the IC module 12.

[0043] Then, the IC carrier 11 will be detailed with reference to FIGS.5(A) and 5(B), and FIG. 6.

[0044]FIG. 5(A) shows the surface of the IC carrier, and FIG. 5(B) showsthe backside of the IC carrier. As shown in FIG. 5(A), the IC carrier 11comprises a base 11 a of a resin of a length Y1 (about 15.00 mm)×a widthX1 (about 25.00) and the IC module 12 of a length Y2 (an about 10.6mm)×a width X2 (about 12.0 mm) mounted on the base 11 a. A cut-off 11 bis formed on the base 11 a for positioning the IC carrier 11 when the ICcarrier 11 is mounted on a machine or tool for the IC carrier 11 to bemounted on. The cut-off 11 b has a length Z of about 3.00 mm.

[0045]FIG. 6 is a plan view detailing another example of the IC carrieraccording to the present invention. The IC carrier 11 comprises a base11 a, and an IC module 12 mounted on the base 11 a. The IC module 12 hasan external terminal 12 c including 8 contacts (C1-C8), and therespective external terminals 12 c are substantially quadrangular. It ispreferable that the external terminal 12 c is positioned in accordancewith ISO (a position of an IC module of an IC card in accordance withISO). That is, as viewed in FIG. 6, a distance a, a distance b, adistance c and a distance d from the left edge of the IC carrier 11 arerespectively 4.0 mm at maximum, 6.0 mm at minimum, 11.62 mm at maximumand 13.62 mm at minimum, and a distance e, a distance f, a distance g, adistance h, a distance i, a distance j, a distance k and a distance 1from the upper edge of the IC carrier 11 are respectively 2.75 mm atmaximum, 4.45 mm at minimum, 5.29 mm at maximum, 6.99 mm at minimum,7.83 mm at maximum, 9.53 at minimum, 10.37 mm at maximum and a 12.07 atminimum. As viewed in FIG. 6, distances o and q of the IC carrier 11from edges of the sheet frame 13 are respectively 16.48 mm and 6.25 mm.The IC carrier 11 has a shape having a dimension p of 15±0.1 mm and adimension r of 25±0.1 mm. The cut-off has a size having dimensions m andn of 3±0.1 mm.

[0046] Then, materials of the respective members will be described. Thecore sheets 21 of the sheet frame 13 and the IC carrier 11 are formed ofvinyl chloride but may be formed of a hard resin, as of acryl,polymethylmethacrylate, polycarbonate, acrylonitrile-butadiene-styrenecopolymer (ABS), polybutyleneterephthalate (PBT), polymer alloys ofthese resins, or others. Of these resins acryl resin and polycarbonateresin, which are capable of being easily cut, which allows thespot-facing with high precision. Generally hard vinyl chloride with noor a small amount (1-5%) of a plasticizer added is used.

[0047] A material and a thickness of the oversheets 22, 23 preferablyhave an above 80% total light transmission. The oversheets 22, 23 havinga high light transmission are transparent and make color tones ofprinted pictures and patterns visible without impairing appearance. Theoversheets 22, 23 can be formed of a resin of polyvinyl chloride,polycarbonate, polymethylmethacrylate, polybutyleneterephthalate (PBT),cellulose acetate, nylon, ethylene-vinyl acetate copolymer saponificate,polypropylene, polyvinyl butyral, acrylonitrile-butadienestyrenecopolymer, methyl methacrylate-butadiene-styrene copolymer or a polymeralloy of them as long as they have good thermal fusion with the coresheet 21.

[0048] A printing ink vehicle forming the fusion preventing layer 14 ispreferably one that is not dissolved with the core sheet 21 and theoversheets 22, 23 when heated. That is, vinyl chloride and othervinyl-based ones are not used, but cellulose-based ones, as ofnitrocellulose, ethyl cellulose, etc., can be used for this end. Theprinting ink vehicle containing a solvent dissolves the material of thecore sheet 21 and tends to cause the fusion. Accordingly it is alsopreferable that the printing ink is composed of a photo-setting orthermo-setting monomer and contains no solvent. As the photo-setting inka (metha)acrylate-modified resin monomer, such as urethane-based(metha)acrylate, polyester-based (metha)acrylate or others can be usedtogether with a reactive diluent and a photo-setting initiator.

[0049] A Second Embodiment of the Sheet-Framed IC Carrier

[0050]FIG. 2(A) is a plan view of the sheet-framed IC carrier accordingto a second embodiment of the present invention. FIG. 2(B) is asectional view of the sheet-framed IC carrier along the line A-A in FIG.2(A). FIG. 2(C) is a backside view of the sheet-framed IC carrieraccording to the second embodiment.

[0051] The second embodiment shown in FIGS. 2(A) to 2(C) is differentfrom the first embodiment only in that an IC carrier is mounted in arecess 30 in a sheet frame 13, and the IC carrier is held, adhered to anoversheet 23 below a core sheet 21, but is substantially the same as thefirst embodiment shown in FIGS. 1(A) to 1(C), FIGS. 5(a) to 5(B) andFIG. 6. The same members of the second embodiment as those of the firstembodiment are represented by the same reference numbers not to repeattheir detailed explanation.

[0052] A sheet-framed IC carrier according to the present embodimentincludes an IC carrier 11 and a sheet frame 13. The sheet frame 13 isformed of a sheet resin of vinyl chloride or others. The IC carrier 11is held by an oversheet 23 on the opposite side of an IC module. Aperipheral edge slit 13 a is formed along a peripheral edge of the ICcarrier 11. The peripheral edge slit 13 a is indicated by the solid linein FIG. 2(A) and indicated by the dot line on the backside shown in FIG.2(C).

[0053] A fusion preventing layer 14 for preventing the fusion with theoversheet 23 is provided on the surface of the IC carrier 11 opposite tothe IC module 12.

[0054] A Third Embodiment of the Sheet-Framed IC Carrier

[0055] Next, the sheet-framed IC carrier according to a third embodimentof the present invention will be explained with reference to FIG. 3.

[0056] The third embodiment shown in FIG. 3 is different from the firstonly in the structure of the IC carrier 11 but is substantially the samein the other points as the first embodiment shown in FIG. 1(A) to 1(C),FIG. 5(A) to 5(B) and FIG. 6. The same members of the third embodimentas those of the first embodiment are represented by the same referencenumbers not to repeat their detailed explanation.

[0057] In FIG. 3, a sheet frame 13 comprises a core sheet 21 includingan upper core sheet 21 a and a lower core sheet 21 b; oversheets 22, 23;and an IC module recess 17 formed by machining the core sheet 21 bymeans of a spot-facing tool. An IC module 12 of the IC carrier 11 ismounted in the IC module recess 17 machined by the spot-facing tool andis secured to the IC module recess 17 by an adhesive 31. Hollows 17 a,17 b are formed in the IC module recess 17 and function to receive anexcess of the adhesive and mitigate flexural stress. The IC module 12 isadhered especially to a projection 17 c in the IC module recess 17. TheIC module can be fabricated, for example, by mounting an IC chip 12 a ona print substrate 12 b and molding the IC chip 12 a with a sealing resin12 d. The surface of the IC module 12 is an external terminal 12 c.

[0058] In the present embodiment, a peripheral edge slit 13 a defining aperipheral edge of the IC carrier 11 is formed by spot-facing theopposite side of the IC module 12 by a spot-facing tool, and the ICcarrier 11 is held by the oversheet 22. A fusion preventing layer 14 isformed between the oversheet 22 and the IC carrier 11 and preventscomplete fusion of the IC carrier 11 with the oversheet 22 to allow theIC carrier 11 to be easily peeled off at this part.

[0059] In this case, the fusion preventing layer 14 is provided on thesurface of the upper core sheet 21 a forming the IC carrier 11. Printedlayers 15, 16 are respectively provided on the surface of the core sheet21 and the backside of the oversheet 23.

[0060] A Fourth Embodiment of Sheet-Framed IC Carrier

[0061] Next, with reference to FIG. 4, the sheet-framed IC carrieraccording to a fourth embodiment of the present invention will beexplained. The fourth embodiment shown in FIG. 4 is different from thethird embodiment shown in FIG. 3 only in that an IC carrier 11 ismounted in a recess 30 in a sheet frame 13, and the IC carrier 11 isheld by an lower oversheet 23 of a core sheet 21 but is substantiallythe same in the other points as the third embodiment shown in FIG. 3.

[0062] The same members of the fourth embodiment as those of the thirdembodiment are represented by the same reference numbers not to repeattheir detailed explanation.

[0063] In FIG. 4 a peripheral edge slit 13 a defining a peripheral edgeof the IC carrier 11 is formed from the side of the IC module 12 by aspot-facing tool, and the IC carrier 11 is held by the oversheet 23. Afusion preventing layer 14 is formed between the oversheet 23 and the ICcarrier 11, and prevents complete fusion of the IC carrier 11 with theoversheet 23 and allows the IC carrier 11 to be easily peeled off atthis part.

[0064] In this case, the fusion preventing layer 14 is provided on thesurface of a lower core sheet 21 b forming the IC carrier 14.

[0065] In the third and the fourth embodiments the IC carrier 11 can beeasily removed from the sheet frame 13, but in the fourth embodiment theIC carrier 11 is contact the oversheet 23 at a larger area than in thethird embodiment to strongly secure the IC carrier 11. The oversheet 22remains on the side of the IC module 12 after the IC carrier 1 has beenremoved, which allows the IC carrier 11 to have better appearance.

[0066] Embodiments of Production of the Sheet-Frame IC Carrier and Useof the Sheet-Framed IC Carrier

[0067]FIG. 7 is a flow chart of the production process of thesheet-framed IC carrier according tot he present invention.

[0068] First in accordance with the method of producing a usual plasticcard, the core sheet 21 having the upper core sheet 21 a and the lowercore sheet 21 b to be the front side and the back side of the core sheet21, and the upper and the lower oversheets 22, 23 are laid one onanother and press-adhered. The core sheet 21 may be formed of one sheetas required, and therefore either of the upper and the lower oversheets22, 23 may be omitted.

[0069] Before the above press-adhered process, the usual ornamentalprint layer 15 is suitably provided on a surface 21 of the core sheet 21to be faced outside by silk screen printing or offset printing (S1, S2).The oversheets 22, 23 are cut off into a required size (S3).

[0070] Then, the fusion preventing layer 14 is provided on the coresheet 21 by printing or other means (S4, S5). As described above, thefusion preventing layer 14 is for forming the peeling portion where theIC carrier 11 is easily peeled off (released off) the oversheets 22, 23.The fusion preventing layer 14 is formed on the surface of the uppercore sheet 21 a on the side of the IC module 12, which contacts theoversheet 22 in the third embodiment shown in FIG. 3, and in the fourthembodiment shown in FIG. 4 on the surface of the lower core sheet 21 b,which contacts the oversheet 23. Accordingly, either of the steps S4 andS5 is selected in accordance with specifications.

[0071] The fusion preventing layer 14 can be formed by a method otherthan offset printing, but offset printing is more advantageous in thatthe function of the fusion preventing layer 14 can be optionallyadjusted dependidng on area percentages of halftone dots, and the fusionpreventing layer 14 can be formed thin. The same effect can be achievedby halftone dot typographic printing or inverted halftone gravurealthough their practical possibility is low. Silk screen printing andthe usual coating will find it difficult to control halftone dot areapercentages.

[0072] To facilitate the peel-off, an area percentage of halftone dotsforming the fusion preventing layer 14 is suitably 60-80%. For somefusability, a 40-60% halftone dot area percentage is suitable. When ahalftone dot area is below 40%, strong fusion takes place between theoversheets 22, 23 and the core sheet 21, unpreferably with a risk thatthe IC carrier might be broken. But a degree of the fusion preventiondepends on characteristics of an ink and the following press conditions,and further material qualities of the oversheets 22, 23 and the coresheet 21, and the above-described halftone dot area percentage cannot beuniformly defined.

[0073] The fusion preventing layer 14 can have a higher halftone dotarea percentage at the peripheral edge of the IC carrier 11 and a lowerhafltone dot area percentage at the central part of the IC carrier 11.When the IC carrier 11 is peeled off, usually the peripheral part of theIC carrier 11 will be pressed with finger tips to peel off a part of theedge of the IC carrier 11, and the partially peeled edge is pinched withfingers to release the IC carrier 11. Accordingly, it is not necessarythat the IC carrier 11 is made especially easily releasable at the partother than the peripheral part thereof, and the hafltone dot area issmaller at the central part of the IC carrier 11. In a case that the ICcarrier 11 generally has very weak adhesion with respect to theoversheets 22, 23, a problem is that the IC carrier 11 may unexpectedlyfall and be lost.

[0074] Next, arrangement of the halftotne dots on the fusion preventinglayer 14 will be explained with reference to 13 FIGS. 8(A) to 8(C). FIG.8(A) shows a case that the fusion preventing layer 14 is printed on thesurface of the IC carrier 11 on the side of the IC module 12. FIG. 8(B)shows a case that the fusion preventing layer 14 is printed on thebackside. In both cases the fusion preventing layer 14 can be formed inthe same way. FIGS. 8(A) and 8(B) respectively show in the enlargedcircles larger-area hafltone dots 14 a provided on the peripheral partof the IC carrier 11, and smaller-area halftone dots 14 b provided atthe central part of the IC carrier 11.

[0075] In this case, in FIG. 8(A) the IC carrier is held by theoversheet 22 (see FIG. 1(B)), and in FIG. 8(B) the IC carrier is held bythe oversheet 23 (see FIG. 2(B)).

[0076] It is possible that as shown in FIG. 8(C), the surface of the ICcarrier 11 on the side of the IC module 12 is divided in two regions,and the fusion preventing layer 14 is not provided in one region 33 withthe IC module 12 and is provided only in the other region 34. The ICcarrier 11 shown in FIG. 8(C) substantially corresponds to that shown inFIG. 8(A). In the IC carrier 11 shown in 8(C), the fusion preventinglayer 14 is provided in the other region 34, whereby the IC carrier 11can be easily peeled off the sheet frame 13 in the other region 34.

[0077] Then, in accordance with the flow chart shown in FIG. 7, theupper core sheet 21 a, the lower core sheet 21 b, and the oversheets 22,23 are laid one on another and sandwiched by specular plates and pressedthe respective sheets 21 a, 21 b, 22, 23 by a press machine to fuse them(S6). The press is performed at 150° C. for 15 minutes in a case thatthe respective sheets 21 a, 21 b, 22, 23 are formed of vinyl chlorideresin.

[0078] Then, the fused sheets 21 a, 21 b, 22, 23 are punched in a cardsize (S7). Transfer foil for the sign panel 19 is transferred to thethus-prepared card (S8). The sign panel 19 is for the signature of a useof the card, and a well-known type of the sign panel is a transfer foilof a layer of a material which is easy to write. Then, indications 18 a,18 b, such as a manufacturer's serial number, information of an issuer,necessary bar codes, etc., are thermo-transferred by the use ofthermo-transfer ribbons or others (S9). The indications 18 a, 18 b maybe printed by laser marking.

[0079] Next, the IC (module) recess 17 for the IC module 12 to bemounted in is formed in the card by a spot-facing tool (S10). At thistime, in the third embodiment shown in FIG. 3 the IC module recess 17 iscut deeper by a thickness of the upper oversheet 22 than the IC modulerecess 17 of the fourth embodiment shown in FIG. 4 so that the externaloutput 12 c of the IC module 12 is not projected beyond the plane of theIC carrier 11. Following the formation of the recess 17 by thespot-facing the peripheral edge slit 13 a defining the peripheral edgeof the IC carrier 11 is formed along the outer periphery of the ICmodule 12. At this time, in the first and the third embodimentsrespectively shown in FIGS. 1 and 3 the spot-facing is performed on theopposite side of the IC module 12, and the spot-facing is performed onthe side of the IC module 12 in the second and the fourth embodimentsrespectively shown in FIGS. 2 and 4.

[0080] The spot-facing is performed in a depth which allows the coressheet 21 to be completely cuts off but does not allow the oversheets 22,23 to be cut off (the oversheets 22, 23 may be cut by a part of theirthickness) (S11). It is possible that the spot-facing may be performedby the so-called half blanking in which the core sheet 12 is completelycut off by punching, but the oversheets 22, 23 are not cut off.

[0081] Then, a thermo-setting adhesive is injected into the IC modulerecess 17 for the IC module 12, and the IC module 12 is mounted and ispressed by hot platens (S12). The IC module 12 is thus mounted on thecard into which the sheets 21 a, 21 b, 22 and 23 for the IC carrier 11have been press-fused and punched. The IC module 12 can be adhered byother adhesives, adhesive double coated seals or by the use of both.Next, IC inspections for IC characteristics, etc. are conducted on theIC module 12 (S13). Then, an issue processing step of writing data inaccordance with a use of the IC carrier is performed (S14). The issueprocessing is specifically for inputting in memories the telephonenumber of a subscriber, the ID number of the subscriber, the pass wordof the subscriber, etc. Then, the step of fitting the sheet-framed ICcarrier into a base with a slit, and enveloping the same, closing theenvelope and delivering the same (S15).

[0082] In the above-described steps the printing of numbers, etc. (S9)may be performed after the module sealing (S12), and the spot-facing ofthe IC module (S10) and the spot-facing of the IC carrier (S11) may bereplaced in sequence by each other.

[0083] The above-described method for producing a sheet-framed ICcarrier according to the present invention is the same except printingthe fusion preventing layer 14 and spot-facing the peripheral edge slit3 a defining the peripheral edge of the IC carrier 11 as theconventional method for producing an IC card. Furthermore, because thestep of printing the fusion preventing layer 14 and the step ofspot-facing the peripheral slit 13 a can be performed by the productionequipment for the conventional IC card, the step of various inspectionsof the IC carrier 11, and the packaging and delivery step of theenveloping can be performed by the process of producing the IC card asit is, and sufficient machining precision can be ensured.

[0084] Generally cards, such as sheet frames, are restricted to have a0.76 mm±0.08 mm thickness. For the sheet frame 13 having such thickness,the peripheral edge slit 13 a has preferably a 0.1-3.0 mm width. Whenthe peripheral edge slit 13 a has a width of above 3.0 mm, unexpectedpeel-off may take place, and the appearance is not satisfactory. Whenthe peripheral edge slit 13 a has a width of below 0.1 mm, a spot-facingdrill is so thin that the spot-facing step is made difficult. When theperipheral edge slit 13 a has a width of below 0.5 mm, it is preferablefor efficiency that the peripheral edge slit 13 a is formed by punchingby a press in place of the spot-facing.

[0085] Then, the method of using the sheet-framed IC carrier will beexplained with reference to FIG. 9(A) to FIG. 10(B).

[0086] FIGS. 9(A) and 9(B) are view showing states of the IC carrier 11held by the oversheet 22 which is peeled off the sheet frame 13. In thiscase, the fusion preventing layer 14 is formed on the surface of the ICcarrier on the side of the IC module 12, and the oversheet 22 is left onthe side of the sheet frame 13 with none of the oversheet 22 left on thebackside of the IC carrier 11. Accordingly, when the indication 18 b,such as numbers, etc., are printed, it is necessary to print theindication on the surface of the IC carrier 11 on the side opposite tothe IC module 12.

[0087] FIGS. 10(A) and 10(B) are views showing states of the IC carrier11 held by the oversheet 23, which is peeled off the sheet frame 13. Inthis case, the fusion preventing layer 14 is formed on the surface ofthe IC carrier 11 on the side opposite to the IC module 12, and theoversheet 23 is left on the side of the sheet frame 13 with none of theoversheet 23 left on the backside of the IC carrier 11. Accordingly, theindication 18 b, such as numbers, etc., can be printed on the surface ofthe IC carrier on the side of the IC module 12.

[0088] As apparent in FIG. 9(A) to FIG. 10(B), in the respective casesafter the IC carrier 11 is removed from the sheet frame 13, the base 11of the IC carrier 11 and the external terminal 12 c of the IC module arein the same plane.

EXAMPLES

[0089] Next, examples of the present invention will be explained.

Example 1

[0090] The sheet-framed IC carrier 10 shown in FIG. 3 was produced bythe production process shown in FIG. 7. The process will be explainedwith reference to FIG. 7.

[0091] A polymer alloy (heat resistance temperature: 120° C.) preparedby mixing acrylonitrile-butadiene-styrene (ABS) resin (50 weight parts)and polycarbonate resin (50 weight parts) was blended with titaniumoxide (5 weight parts) and was extruded by T die technique into the coresheet 21 of 0.35 mm-thickness formed of a white upper core sheet 21 anda white lower core sheet 21 b. The core sheet 21 was formed of a polymeralloy of such resins to be easily cut for the spot-facing and especiallyto have higher heat resistance which allows the IC carrier to enduresevere environments, e.g., the IC carrier 11 is left in a car in the hotsummer weather, while ensuring, for example, sheeting propertiesrequired of the sheet frame 12.

[0092] The print layer of 6 colors 15 is formed on a required part ofthe upper core sheet 21 a of the core sheet 21 by silk screen printing(S2). The print layer of 1 color 15 is formed on a required part of thelower core sheet 21 b by silk screen printing (S1). Next, a transparentoffset print was made only on a part of the upper core sheet 21 acorresponding to the IC carrier by using an UV-setting ink (“KALTON OPNISU” by The Intek Kabushiki Kaisha) (S5). This offset printed part isto be the fusion preventing layer of the IC carrier 11. In this case,the fusion preventing layer 14 was formed so that the 2 mm-widthperipheral part of the IC carrier 22 has a 70% halftone dot areapercentage and a 40% hafltone dot area percenetage at the other part,e.g., the central part of the IC carrier 11.

[0093] On the other hand, the oversheets 22, 23 were provided by a 50μm-thickness polycarbonate resin film. The oversheets 22, 23 were cut inthe same size as the core sheet 21, loaded into a fusion-press,sandwiched by specular platens, and fusion-pressed under conditions of160° C., 20 kgf/cm² and 10 minutes (S6). Thus the respective sheets 21a, 21 b, 22, 23 were fusion-adhered to each other. Becausepolycarbonate-based resins have high fusion points, the fusion press wasset at a temperature higher than 150° C. of the usual hard vinylchloride.

[0094] Then, the fusion-adhered sheets 21 a, 21 b, 22, 23 were punchedin a card size, and a transfer foil for a sign panel 19 was transferredto a required part of each of the punched cards (S8). The sign panel 19is for the signature of the user of the card. Then, information(indications) 18 a, 18 b, such as a manufacturer's number, required barcodes, etc., were printed by thermo-transfer (S9).

[0095] Next, the IC module recess 17 for the IC module 12 to be mountedon was formed in the card by spot-facing (S10). In this case, the ICmodule 12 has a 0.6 mm-thickness, the recess had a 0.65 mm-thicknessfrom the surface of the oversheet. The IC module recess 17 was formed soas to have the sectional shape, as shown in FIG. 3, having a half-cutspace 17 a around the IC module recess 17. This structure can mitigateexternal flexural stress.

[0096] To define a shape of the IC carrier 11, after the IC modulerecess 17 was formed, the spot-facing was performed on the side of thebackside of the card (the surface opposite to the surface with the ICmodule 12 mounted on) to a depth which did not cut off the oversheet 22,and the sheet frame 13 and the IC carrier 11 were defined (S11).

[0097] Then, a thermo-setting adhesive was dropped into the IC modulerecess 17, the IC module 12 was mounted in the IC module recess 17, andthe IC module was sealed (S12). IC inspections, as of functions, etc. ofthe IC module 12 were made (S13). Then, the telephone number, the IDnumber, etc. of a subscriber were inputted in the memories, and theissue processing was performed (S14).

[0098] The part where the IC carrier 11 is positioned was pressed fromthe surface of the IC carrier with fingers, whereby the IC carrier 11could be readily peeled off the sheet frame 13. At this time, the fusionpreventing layer 14 was left on the IC carrier 11 capably of protectingthe print layer 15.

Example 2

[0099] The sheet-framed IC carrier 10 shown in FIG. 4 was produced bythe production process shown in FIG. 7. The same basic materials as inExample 1 were used. A 6-color print was made on a required part of theupper core sheet 21 a by silk screen printing. A 1-color print was madeon a required part of the lower core sheet 21 b by silk screen printing.Next, a transparent offset print was made only on a part of the lowercore sheet 21 a corresponding to the IC carrier by using an UV-settingink (“KALTON M OP NISU” by The Intek Kabushiki Kaisha), and the fusionpreventing layer 14 was formed (S4). In this case, the fusion preventinglayer 14 was processed so that the 3 mm-width peripheral part of the ICcarrier 22 has a 70% halftone dot area percenetage and a 40% hafltotnedot area percentage at the other part, e.g., the central part of the ICcarrier Then, the steps up to the spot-facing of the IC module recess 17for the IC module (S10) were performed in the same way as in Example 1.To define a shape of the IC carrier 11, after the IC module recess 17was formed, the peripheral slit 13 a was spot-faced on the surface ofeach card (the surface with the IC module 12 mounted on) to a depthwhich did not cut off the oversheet 23, and the sheet frame 13 and theIC carrier 11 were defined (S11). Then, a thermo-setting adhesive wasdropped into the IC module recess 17, and the IC module 12 was mountedin the IC module recess 17, and the IC module was sealed (S12). ICinspections, as of functions, etc. of the IC module 12 were made (S13).Then, the telephone number, the ID number, etc. of a subscriber wereinputted in the memories, and the issue processing was performed (S14).

[0100] The part where the IC carrier 11 is positioned was pressed fromthe surface of the IC carrier 11 with fingers, whereby the IC carrier 11could be readily peeled off the sheet frame 13.

What is claimed is:
 1. A sheet-framed IC carrier comprising: a sheetframe including a core sheet and an oversheet provided on at least onesurface of the core sheet, and including a recess formed therein withthe oversheet left; and an IC carrier mounted in the recess of the sheetframe, held by the oversheet left in the recess and including an ICmodule.
 2. A sheet-framed IC carrier according to claim 1 , wherein afusion-preventing layer is provided on an adhesion surface of the ICcarrier to which the oversheet is adhered.
 3. A sheet-framed IC carrieraccording to claim 2 , wherein the fusion preventing layer is formed ona surface of the IC carrier on the side of the IC module.
 4. Asheet-framed IC carrier according to claim 2 , wherein the fusionpreventing layer is formed on a surface of the IC carrier on theopposite side of the IC module.
 5. A sheet-framed IC carrier accordingto claim 2 , wherein the fusion preventing layer is a print applicationlayer of a solvent-free photo-setting or thermo-setting ink.
 6. Asheet-framed IC carrier according to claim 2 , wherein the fusionpreventing layer includes a number of halftone dots, the fusionpreventing layer is divided in a plurality of regions, and halftone dotarea percentages of the respective regions are different from eachother.
 7. A sheet-framed IC carrier according to claim 1 , wherein theIC carrier includes another core sheet and another oversheet provided onat least one surface of the core sheet; and the core sheets of the sheetframe and the IC carrier and the oversheets of the sheet frame and theIC carrier are formed of the same composition respectively.
 8. Asheet-framed IC carrier according to claim 7 , wherein the core sheetsof the sheet frame and the IC carrier, and the oversheets of the sheetframe and the IC carrier are formed of vinyl chloride resin.
 9. Asheet-framed IC carrier according to claim 1 , wherein the core sheet orthe oversheet is formed of polycarbonate resin; a mixture ofpolycarbonate resin and ABS resin; a mixture of polycarbonate resin andPET resin; or a mixture of polycarbonate resin and PBT resin.
 10. Amethod for producing a sheet-framed IC carrier including a sheet framewhich has a core sheet and an oversheet provided on at least one surfaceof the core sheet and has a recess formed therein with the oversheetleft; and an IC carrier which is mounted in the recess of the sheetframe and held by the oversheet left in the recess, and has an ICmodule, the method comprising the steps of: laying the oversheet on atleast one surface of the core sheet and press-fusing the core sheet andthe oversheet to each other; spot-facing the core sheet to form therecess; forming in the core sheet a peripheral slit to be a peripheraledge of the IC carrier; and mounting the IC module in the recess.
 11. Amethod for producing a sheet-framed IC carrier according to claim 10 ,further comprising the step of providing a required print layer on thecore sheet before the oversheet is laid on the core sheet.
 12. A methodfor producing a sheet-framed IC carrier according to claim 10 , furthercomprising the step of forming a fusion preventing layer on a portion ofthe core sheet corresponding to the IC carrier before the oversheet islaid on the core sheet.
 13. A method for producing a sheet-framed ICcarrier according to claim 12 , wherein the fusion preventing layer isformed on a surface of the core sheet on the side of the IC module. 14.A method for producing a sheet-framed IC carrier according to claim 12 ,wherein the fusion preventing layer is formed on a surface of the coresheet on the oppositse side of the IC module.
 15. A method for producinga sheet-framed IC carrier according to claim 12 , wherein the fusionpreventing layer is formed of a solvent-free photo-setting orthermo-setting ink.